Tuesday, July 30, 2013

Novel material for cooling of electronic devices discovered

[unable to retrieve full-text content]As microelectronic devices become smaller, faster and more powerful, thermal management becomes a critical challenge. This research provides new insight into the nature of thermal transport at a quantitative level.

Source: http://feeds.sciencedaily.com/~r/sciencedaily/matter_energy/electronics/~3/9Sj4YEbkSIE/130729133133.htm

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